About us

Recruiting Procedure:

TitleHeadcountRelease DateEducation

The graduating class of 2027402026-10-12Bachelor's degree or above

Requirements: 1. Bachelor's degree or above (master's degree or above is preferred) in the 2027 unified enrollment, with priority given to majors related to microelectronics, semiconductor integrated circuits, electronic science and technology, and physics;
2. Smart and hardworking, with strong communication and coordination skills, clear logical thinking, and great potential for cultivation and development;
3. Strong self drive ability, high execution ability, skilled in teamwork and communication, with a strong interest in R&D, engineering, product, and quality positions, and willing to develop in related fields for a long time;
4. Capable of withstanding certain work pressure, with clear work ideas and great potential for cultivation and development, fluent in English listening, speaking, reading, and writing is preferred.
5. All positions require passing the College English Test Band 4 (CET-4) for English proficiency;

Responsibilities

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Outsourcing Operation Manager12026-08-06Bachelor’s degree or above

Requirements: 1.Take charge of end‑to‑end operational management for outsourced semiconductor packaging & testing suppliers, including supplier qualification, daily liaison, capacity coordination, delivery control and performance evaluation.
2.Oversee outsourced capacity planning, order allocation and delivery follow‑up; coordinate production‑line abnormalities, material issues and yield problems to ensure on‑time order delivery.
3.Cooperate with Quality, Process and R&D teams to implement process quality control for outsourced manufacturers, drive 8D corrective‑action closure for non‑conformities, improve product yield and facilitate NPI launch at outsourced sites.
4.Conduct outsourcing price negotiation, statement reconciliation & settlement, cost control, and deliver annual cost‑reduction targets together with compliant expense management.
5.Establish outsourcing operation management policies and supplier scoring systems; conduct regular performance reviews to drive continuous improvement and supplier rationalization.
6.Liaise internally with Planning, Procurement, Quality and Finance departments; manage external outsourced factories; handle urgent and major delivery‑ and quality‑related incidents.

Responsibilities: 1.Bachelor’s degree or above, major in Microelectronics, Electronic Information, Supply Chain Management, Industrial Engineering or related disciplines.
2.Minimum 5‑year working experience in semiconductor / power device / discrete‑device industry, with at least 3‑year hands‑on experience in outsourced packaging‑&‑testing operation, supplier management and subcontract production coordination.
3.Familiar with semiconductor packaging & testing workflows; competent in capacity planning, delivery‑schedule control, quality‑issue resolution and commercial negotiation.
4.Knowledge of quality tools including IATF16949, 8D and SPC; strong capabilities in data analysis, cross‑functional coordination and issue resolution.
5.Resilient under pressure, rigorous, result‑oriented; accept irregular business trips to outsourced manufacturing sites.
6.Prior experience in automotive‑electronics industry, key‑customer engagement or team management is preferred.

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DQE Engineer12026-08-06Bachelor’s degree or above, CET‑6

Requirements: 1.Design quality control: formulate quality access standards for each development phase; participate in schematic and layout reviews; assess reliability risks brought by ECO modifications.
2.Reliability and failure analysis: develop verification schemes complying with industrial standards; follow up root‑cause analysis for failed samples; coordinate chip failure detection and close out 8D corrective‑action reports.
3.New‑product introduction governance: compile R&D quality data, analyze engineering‑lot yield defects, conduct post‑trial‑run reviews, complete design release for mass‑production confirmation, and manage full‑process PPAP documentation.
4.Customer interface and standard systematization: support customer‑side APQP audits; build a design‑quality knowledge base and standardize R&D design specifications.

Responsibilities: 1.No gender limitation, age ≥28; Bachelor’s degree or above, major in Microelectronics, Integrated Circuits, Electronic Science, Semiconductor Physics or related fields.
2.CET‑4 or above, capable of reading English datasheets and reliability‑standard documents; 6‑10‑year relevant industry experience (minimum 3‑year for Master holders); ≥4‑year semiconductor‑industry background including ≥3‑year experience in R&D / engineering / design‑quality roles.
3.Sound knowledge of MOSFET, IGBT and analog‑digital IC principles; familiar with full chip development flow from project initiation, design and tape‑out to mass production.
4.Proficient in DFMEA, 8D and DOE statistical analysis; well‑versed in automotive‑ / industrial‑grade reliability standards such as AEC‑Q100/Q101 and JESD47 as well as device failure mechanisms.
5.Outstanding logical reasoning and data‑analysis skills; adept at cross‑department collaboration.
6.Rigorous working style, closed‑loop thinking mindset and strict adherence to design‑quality criteria.

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MOS R&D Manager12026-08-06Bachelor’s degree or above

Requirements: 1.Lead end‑to‑end development of MOS and IGBT products covering concept definition, device design, prototyping, reliability validation and mass‑production roll‑out.
2.Define product technical roadmaps and electrical specifications; oversee key milestones for tape‑out, packaging and testing.
3.Drive MOS & IGBT product development to satisfy relevant certification requirements and reliability targets.
4.Cooperate with wafer‑design and packaging‑&‑testing teams to accelerate product development, yield enhancement and new‑product mass‑production introduction.
5.Manage R&D team, allocate project resources, standardize NPI workflows and build technical talent pipeline.
6.Collaborate with Marketing, Quality and Application teams for product promotion, system certification and technical support for customer complaints.

Responsibilities: 1.Bachelor’s degree or above, major in Microelectronics, Semiconductor Physics, IC design or related disciplines; good English proficiency.
2.≥8‑year hands‑on experience in power‑MOS device development, including minimum 3‑year team‑management experience.
3.Solid semiconductor‑physics foundation; proficient in simulation tools and layout‑design software; experienced in full automotive‑grade development cycles; proven track record of independently bringing multiple‑MOS products from R&D to mass‑production is preferred.
4.Competent with DOE, SPC and FMEA methodologies as well as failure analysis; familiar with MOS performance & reliability testing and industrial standards; understanding of MOS real‑world applications is a plus.
5.Excellent leadership and cross‑functional coordination; prior experience collaborating with wafer foundries and packaging‑&‑testing subcontractors is preferred.

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Field Application Engineer (Domestic)32026-08-06Bachelor’s degree or above

Requirements: 1.Customer technical support: act as technical liaison between the company and customers to deliver full‑cycle technical services.
2.Product testing & validation: assist customers to set‑up test environments; participate in sample testing, performance debugging and issue reproduction; generate test reports and optimize test protocols.
3.Customer‑need mining & internal alignment: deeply understand customer application scenarios including industrial control, new‑energy vehicles and consumer electronics; identify latent technical requirements and product‑improvement suggestions; feed insights back to R&D and Marketing to support product iteration and customized‑solution development.
4.Market & competitor analysis: collect customer feedback on competing products and track technical market trends; assist Marketing to compile competitor‑analysis reports to inform corporate product positioning and marketing‑strategy adjustment.

Responsibilities: 1.Bachelor’s degree or above, major in Electronic Engineering, Microelectronics, Automation, Communication Engineering or related majors.
2.≥2‑year experience as FAE, application‑support engineer or R&D‑test engineer within electronics / semiconductor industry.
3.Practical working experience with chips (MCU, power devices, sensors etc.) or electronic modules is preferred.
4.In‑depth familiarity with at least one vertical‑application field such as industrial automation, automotive electronics, consumer electronics or new‑energy industry is preferred.

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Field Application Engineer (Overseas)42026-08-06Bachelor’s degree or above, CET‑6

Requirements: 1.Customer technical support: act as technical liaison between the company and customers to deliver full‑cycle technical services.
2.Product testing & validation: assist customers to set‑up test environments; participate in sample testing, performance debugging and issue reproduction; generate test reports and optimize test protocols.
3.Customer‑need mining & internal alignment: deeply understand customer application scenarios including industrial control, new‑energy vehicles and consumer electronics; identify latent technical requirements and product‑improvement suggestions; feed insights back to R&D and Marketing to support product iteration and customized‑solution development.
4.Market & competitor analysis: collect customer feedback on competing products and track technical market trends; assist Marketing to compile competitor‑analysis reports to inform corporate product positioning and marketing‑strategy adjustment.

Responsibilities: 1.Bachelor’s degree or above, major in Electronic Engineering, Microelectronics, Automation, Communication Engineering or related majors.
2.≥2‑year experience as FAE, application‑support engineer or R&D‑test engineer within electronics / semiconductor industry.
3.Practical working experience with chips (MCU, power devices, sensors etc.) or electronic modules is preferred.
4.In‑depth familiarity with at least one vertical‑application field such as industrial automation, automotive electronics, consumer electronics or new‑energy industry is preferred.

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Senior Engineer (ESD & Small‑Signal Devices)12026-08-06Bachelor’s degree or above

Requirements: 1.Complete device design, simulation and solution development for ESD‑protection devices and small‑signal diodes; define device architecture, layout and process specifications.
2.Perform TCAD simulation and electrical‑ & reliability‑performance validation; optimize key parameters such as VF, IR, trr, leakage current and ESD robustness while balancing performance and cost.
3.Coordinate with wafer foundries for tape‑out and process tuning; monitor engineering‑lot and mass‑production‑lot testing; identify electrical‑ and reliability‑related failures and implement closed‑loop corrective actions.
4.Generate device datasheets, design documents and process specifications; cooperate with Quality team to complete DFMEA and reliability testing to satisfy automotive‑ / industrial‑grade standards.
5.Work cross‑functionally with Process, Packaging, Test and Marketing teams to resolve mass‑production‑yield risks and customer‑application failures; iterate next‑generation device platforms.
6.Research cutting‑edge technologies including SiC, high‑voltage FRD and high‑end ESD devices; execute technical pre‑research and formulate product‑iteration roadmaps.

Responsibilities: 1.No gender limitation, age under 40; Bachelor’s degree or above in Microelectronics, Integrated Circuits, Semiconductor Physics, Electronic 2.Science or related fields; CET‑4, capable of reading English device standards and technical literature.
3.6‑10‑year R&D experience in semiconductor discrete devices (minimum 3‑year for Master holders); ≥4‑year practical discrete‑device design‑and‑development experience.
4.Mastery of small‑signal diode, ESD‑protection‑device and FRD fast‑recovery‑diode design; SiC‑diode‑development experience is preferred.
5.Hands‑on experience with Sentaurus or equivalent TCAD simulation tools; solid understanding of semiconductor‑device physics, 6.PN‑junction, terminal‑voltage‑withstand structures and carrier‑recombination mechanisms.
7.Familiar with full discrete‑device tape‑out workflow; experienced in reliability tests including HTOL, TC, ESD, HBM and MM as well as failure‑analysis methodologies.
8.Competent in DFMEA and 8D problem‑solving; skilled in DOE design‑of‑experiments and statistical‑data analysis.
9.Clear logical thinking, strong cross‑functional communication skills; pragmatic, rigorous and result‑driven with closed‑loop project‑delivery awareness.

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Senior Engineer (Schottky & TVS)12026-08-06Bachelor’s degree or above

Requirements: 1.Complete device design, simulation and solution development for Schottky and TVS devices; define device architecture, layout and process specifications.
2.Perform TCAD simulation and electrical‑ & reliability‑performance validation; optimize key parameters such as VF, IR, trr, leakage current and ESD robustness while balancing performance and cost.
3.Coordinate with wafer foundries for tape‑out and process tuning; monitor engineering‑lot and mass‑production‑lot testing; identify electrical‑ and reliability‑related failures and implement closed‑loop corrective actions.
4.Generate device datasheets, design documents and process specifications; cooperate with Quality team to complete DFMEA and reliability testing to satisfy automotive‑ / industrial‑grade standards.
5.Work cross‑functionally with Process, Packaging, Test and Marketing teams to resolve mass‑production‑yield risks and customer‑application failures; iterate next‑generation device platforms.
6.Research cutting‑edge technologies including SiC, high‑voltage FRD and high‑end ESD devices; execute technical pre‑research and formulate product‑iteration roadmaps.

Responsibilities: 1.No gender limitation, age under 40; Bachelor’s degree or above in Microelectronics, Integrated Circuits, Semiconductor Physics, Electronic 2.Science or related fields; CET‑4, capable of reading English device standards and technical literature.
3.6‑10‑year R&D experience in semiconductor discrete devices (minimum 3‑year for Master holders); ≥4‑year practical discrete‑device design‑and‑development experience.
4.Mastery of small‑signal diode, ESD‑protection‑device and FRD fast‑recovery‑diode design; SiC‑diode‑development experience is preferred.
5.Hands‑on experience with Sentaurus or equivalent TCAD simulation tools; solid understanding of semiconductor‑device physics, 6.PN‑junction, terminal‑voltage‑withstand structures and carrier‑recombination mechanisms.
7.Familiar with full discrete‑device tape‑out workflow; experienced in reliability tests including HTOL, TC, ESD, HBM and MM as well as failure‑analysis methodologies.
8.Competent in DFMEA and 8D problem‑solving; skilled in DOE design‑of‑experiments and statistical‑data analysis.
9.Clear logical thinking, strong cross‑functional communication skills; pragmatic, rigorous and result‑driven with closed‑loop project‑delivery awareness.

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Senior Engineer (FRD & SiC)12026-08-06Bachelor’s degree or above

Requirements: 1.Complete device design, simulation and solution development for FRD fast‑recovery diodes and SiC devices; define device architecture, layout and process specifications.
2.Perform TCAD simulation and electrical‑ & reliability‑performance validation; optimize key parameters such as VF, IR, trr, leakage current and ESD robustness while balancing performance and cost.
3.Coordinate with wafer foundries for tape‑out and process tuning; monitor engineering‑lot and mass‑production‑lot testing; identify electrical‑ and reliability‑related failures and implement closed‑loop corrective actions.
4.Generate device datasheets, design documents and process specifications; cooperate with Quality team to complete DFMEA and reliability testing to satisfy automotive‑ / industrial‑grade standards.
5.Work cross‑functionally with Process, Packaging, Test and Marketing teams to resolve mass‑production‑yield risks and customer‑application failures; iterate next‑generation device platforms.
6.Research cutting‑edge technologies including SiC, high‑voltage FRD and high‑end ESD devices; execute technical pre‑research and formulate product‑iteration roadmaps.

Responsibilities: 1.No gender limitation, age under 40; Bachelor’s degree or above in Microelectronics, Integrated Circuits, Semiconductor Physics, Electronic 2.Science or related fields; CET‑4, capable of reading English device standards and technical literature.
3.6‑10‑year R&D experience in semiconductor discrete devices (minimum 3‑year for Master holders); ≥4‑year practical discrete‑device design‑and‑development experience.
4.Mastery of small‑signal diode, ESD‑protection‑device and FRD fast‑recovery‑diode design; SiC‑diode‑development experience is preferred.
5.Hands‑on experience with Sentaurus or equivalent TCAD simulation tools; solid understanding of semiconductor‑device physics, 6.PN‑junction, terminal‑voltage‑withstand structures and carrier‑recombination mechanisms.
7.Familiar with full discrete‑device tape‑out workflow; experienced in reliability tests including HTOL, TC, ESD, HBM and MM as well as failure‑analysis methodologies.
8.Competent in DFMEA and 8D problem‑solving; skilled in DOE design‑of‑experiments and statistical‑data analysis.
9.Clear logical thinking, strong cross‑functional communication skills; pragmatic, rigorous and result‑driven with closed‑loop project‑delivery awareness.

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Sales Engineer (Domestic)62026-08-06Bachelor’s degree or above

Requirements: 1.Formulate and execute sales strategies & plans for semiconductor packaging‑&‑testing products.
2.Develop and maintain customer relationships within semiconductor packaging‑&‑testing sector to secure customer satisfaction and revenue growth.
3.Organize sales team to hit sales KPIs and deliver effective team management & training.
4.Analyze market trends and track industry dynamics to generate actionable market insights for the company.
5.Work closely with technical teams to capture customer requirements and drive product improvement & innovation.

Responsibilities: 1.Bachelor’s degree or above; Electronic Engineering, Materials Science or related majors preferred.
2.5‑10‑year sales experience in semiconductor packaging‑&‑testing industry.
3.Strong market‑analysis capability and sales‑strategy planning competency.
4.Excellent communication, negotiation and leadership skills; proven sales‑team management capability.
5.Sound knowledge of semiconductor packaging‑&‑testing products, technologies and market trends.
6.Strong negotiation skill and customer‑service mindset; capable of independently resolving complex sales issues.
7.Good team‑player; deliver high‑quality output under heavy‑pressure working conditions.

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Sales Engineer (Overseas)62026-08-06Bachelor’s degree or above, CET‑6

Requirements: 1.Customer development & account management: promote discrete‑device product portfolio including diodes, bridge rectifiers, small‑signal semiconductors, MOSFETs and IGBTs; deepen existing European‑ & American‑customer relationships and acquire new key accounts across automotive‑electronics, industrial‑control, home‑appliance, power‑supply and medical segments.
2.End‑to‑end project management: oversee full project workflow including RFQ, sample submission, qualification testing, design‑in, nomination and mass‑production PO placement; familiar with automotive‑component qualification flows including A‑sample / B‑sample / 3.C‑sample phases, PPAP release and IMDS‑material‑data submission.
4.Commercial negotiation: manage customer quotation, bargaining and price‑adjustment strategies; resolve commercial disputes regarding price fluctuation, lead‑time and payment‑term arrangements.
5.Technical coordination: collaborate with FAE, R&D and manufacturing teams to address customer technical requests.
6.Market intelligence collection: gather industry insights, competitor pricing, customer‑project updates and supply‑chain volatility; submit regular sales reports and project‑status dashboards.
7.Complaint & exception handling: interface with customers on quality non‑conformities, delivery delays and material substitution; coordinate internal manufacturing resources to guarantee customer mass‑production continuity.

Responsibilities: 1.Bachelor’s degree or above; ≥3‑year discrete‑device‑industry sales experience; well‑versed in diodes, triodes, bridge rectifiers, small‑signal semiconductors and MOSFETs; prior experience at semiconductor IDMs or large distributors is preferred.
2.Existing customer resources covering automotive electronics, power‑supply and industrial‑control sectors; connections with automotive 3.Tier‑1 suppliers, module manufacturers and solution houses are preferred.
4.Basic understanding of semiconductor electrical parameters, package types and device characteristics; familiar with automotive‑component workflows: RFQ, nomination, PO placement and IMDS reporting.
5.Solid competence in quotation, price adjustment and payment‑term negotiation; capable of high‑stakes commercial bargaining with large customers; resilient under pressure.
6.Good English listening, speaking, reading & writing; capable of independent overseas‑customer communication and business‑email drafting; prior engagement with foreign enterprises is preferred.
7.Strong sense of responsibility, logical thinking and execution capability; effective communicator; accept short‑haul and overseas business trips for customer visits, sample‑testing coordination and account reconciliation.

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Marketing Manager12026-08-06Bachelor’s degree or above, CET‑6

Requirements: 1.Lead marketing promotion targeting server, datacenter and telecom‑power‑supply markets; take ownership of segment‑sales, new‑product‑introduction and market‑share objectives; formulate marketing strategies and support revenue growth together with sales teams.
2.Engage deeply with power‑supply manufacturers and server ODM/OEM customers; identify demands for auxiliary power supply, signal‑loop and circuit‑protection applications; drive domestic‑substitution design‑in for small‑signal diodes, Schottky diodes, rectifiers and TVS devices.
3.Track end‑customer projects end‑to‑end; cooperate with FAE and R&D on component selection, sample qualification and mass‑production introduction; resolve project‑related quality and lead‑time bottlenecks.
4.Monitor technical‑industry trends and competitor developments; collect customer requirements and deliver market‑analysis reports to guide product‑definition and new‑product planning.
5.Organize customer technical‑exchange events and internal sales‑enablement sessions; accumulate application notes and component‑selection documents; maintain industry‑ecosystem partnerships.
6.Conduct regular reviews on industry metrics, project pipelines and competitor landscape to iterate marketing‑promotion strategies.

Responsibilities: 1.Bachelor’s degree or above, major in Electronics, Microelectronics, Power Electronics, Electrical Engineering or related disciplines.
2.≥3‑year working experience in semiconductor discrete‑device marketing, product management, FAE or vertical‑segment sales; hands‑on exposure to server / telecom‑power‑supply application ecosystem.
3.Sound understanding of small‑signal diode, Schottky, rectifier and TVS device principles and power‑circuit component‑selection practices.
4.Capable of independent customer‑technical discussions; able to read schematics and datasheets; excellent cross‑department collaboration; accept business trips and work under pressure.
5.Preferred: existing connections with server and top‑tier power‑supply manufacturers; proven discrete‑device Design‑in track‑record; familiarity with domestic discrete‑device vendors.
6.Bonus qualifications: knowledge of server‑power‑supply specifications; prior experience in reliability engineering, DFMEA or product planning.

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Test Engineer12026-08-06Bachelor’s degree or above

Requirements: 1.Customer technical support: act as technical liaison between the company and customers to deliver full‑cycle technical services.
2.Product testing & validation: assist customers to set‑up test environments; participate in sample testing, performance debugging and issue reproduction; generate test reports and optimize test protocols.
3.Customer‑need mining & internal alignment: deeply understand customer application scenarios including industrial control, new‑energy vehicles and consumer electronics; identify latent technical requirements and product‑improvement suggestions; feed insights back to R&D and Marketing to support product iteration and customized‑solution development.
4.Market & competitor analysis: collect customer feedback on competing products and track technical market trends; assist Marketing to compile competitor‑analysis reports to inform corporate product positioning and marketing‑strategy adjustment.

Responsibilities: 1.Bachelor’s degree or above, major in Electronic Engineering, Microelectronics, Automation, Communication Engineering or related majors.
2.≥2‑year experience as FAE, application‑support engineer or R&D‑test engineer within electronics / semiconductor industry.
3.Practical working experience with chips (MCU, power devices, sensors etc.) or electronic modules is preferred.
4.In‑depth familiarity with at least one vertical‑application field such as industrial automation, automotive electronics, consumer electronics or new‑energy industry is preferred.

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Device Test Expert12026-08-06Bachelor’s degree

Requirements

1.Electrical‑parameter testing for devices

‑ Perform static‑parameter characterization for power devices (Diode, BJT, MOSFET, IGBT, SiC, GaN etc.), including BVDSS, RDS(on), VGS(th), IDSS/IGSS, VF, VSD and gfs.
‑ Execute dynamic‑parameter testing for power devices: switching timing td(on)/tr/td(off)/tf, switching‑loss Eon/Eoff, gate‑charge Qg, junction capacitance Ciss/Coss/Crss and reverse‑recovery characteristics trr/Qrr/Irrm.

‑ Conduct thermal‑resistance Rth measurement, unclamped‑inductive‑switching UIS/EAS avalanche‑withstand testing, short‑circuit‑characteristic evaluation and Safe‑Operating‑Area (SOA) validation.

2.Test‑program development and test‑system maintenance

‑ Operate mainstream industry test instruments including Keithley 2400/2600 source‑measure units, Keysight B1506A, semiconductor curve tracers and double‑pulse test systems; develop and debug automated test routines.
‑ Complete hardware assembly, software debugging and upgrade maintenance for power‑device test benches.
‑ Build customized test platforms according to project requirements; optimize test workflows and methodologies.

3.Data analysis and documentation

‑ Collect, organize and statistically analyze test data; detect device‑performance and reliability risks.
‑ Compile test reports and product datasheets; supply data insights to guide product development & optimization.
‑ Support Quality and R&D teams during failure analysis; identify root causes and drive issue closure.

4.Cross‑functional collaboration

‑ Communicate with design engineers and application engineers on technical test challenges and propose optimized test solutions.
‑ Assist to define FT final‑test specifications and CP wafer‑probe test schemes to enable new‑product mass‑production introduction.

Responsibilities

1.Education & Major
‑ Bachelor’s degree or above in Microelectronics, Power Electronics, Semiconductor Physics, Electronic Science & Technology, Electrical Engineering, Automation or related disciplines.

2.Professional Experience

‑ ≥5‑year (Bachelor) / ≥3‑year (Master) hands‑on experience in power‑semiconductor‑device testing.
‑ Prior employment at power‑semiconductor IDM, wafer fab, design house or independent‑testing laboratory is preferred.

3.Domain Knowledge

‑ Deep understanding of working principles, physical characteristics and failure mechanisms for MOSFET, IGBT, Diode, BJT, SiC and GaN power semiconductors.
‑ Comprehensive comprehension of key power‑device electrical parameters, testing theories and influencing factors.
‑ Knowledge of power‑device test standards: MIL‑STD‑750, IEC 60747 series, GB/T29332 etc.

4.Testing Competencies

‑ Master static‑ and dynamic‑parameter‑testing methodologies for power semiconductors.
‑ Proficient with mainstream test equipment: Keysight B1506A semiconductor‑parameter analyzer, Keithley source meters, curve tracers, double‑pulse test benches, oscilloscopes and high‑voltage power supplies.
‑ Capable of test‑platform construction and automated‑test‑program development.
‑ Hands‑on experience with at least one programming language: LabVIEW / Python / C/C++.

5.Soft Skills

‑ Excellent data‑analysis capability and rigorous technical‑document writing skill.
‑ Strong interpersonal communication, teamwork and independent problem‑solving aptitude.

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Outsourcing Resource Development Specialist12026-08-06Bachelor’s degree

Requirements: 1.Source external subcontracting resources covering design subcontracting, solution development and process outsourcing; build qualified‑supplier resource pool.
2.Collaborate with internal Product and R&D teams; clarify outsourcing requirements and define technical specifications, delivery criteria and acceptance standards.
3.Conduct supplier technical assessment, price comparison and commercial negotiation; finalize core contractual clauses.
4.Monitor outsourced‑project progress and quality; resolve roadblocks and drive project acceptance & delivery.
5.Implement supplier‑performance appraisal; maintain supplier ecosystem and phase‑out underperforming vendors.

Responsibilities: 1.Bachelor’s degree in Electronics / Microelectronics or related disciplines; 2‑3‑year working experience in semiconductor subcontracting or product‑project management.
2.Understanding of power‑device development workflows for MOS, diode and SiC products.
3.Competent in supplier technical‑capability evaluation, requirement decomposition and commercial negotiation.
4.Capable of multi‑project parallel management; strong cross‑department coordination and risk‑identification capability.
5.Awareness of project‑confidentiality rules and intellectual‑property‑protection requirements; result‑oriented working style.

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NPI Engineer12026-08-06Bachelor’s degree

Requirements: 1.Manage full‑cycle new‑device‑development projects from initiation to mass‑production based on customer and business requirements.
2.Align cross‑departmental resources; draw‑up project‑management schedules, clarify role allocation & milestones, monitor overall project execution.
3.Complete material selection, early‑stage resource planning and preparation per project requirements; deliver feasibility studies, DOE experiments and qualification reports; host regular review meetings to drive closed‑loop resolution of trial‑run anomalies.
4.Manage OEM subcontract‑manufacturing NPI projects including process‑capability feasibility assessment & certification; deliver professional technical support for customers.
5.Support OEM product‑transfer for mass‑production ramp‑up at AIC overseas production lines.

Responsibilities: 1.Prior new‑product‑development & project‑management experience preferred.
2.Familiar with power‑device packaging materials and manufacturing workflows.
3.Knowledge of DB (Die‑Bond) & WB (Wire‑Bond) processes including aluminum / gold / copper wire bonding; basic equipment‑operation knowledge.
4.Data‑analysis capability; proficient with DOE and JMP statistical software.
5.Practical failure‑analysis experience for MOS, IGBT and power semiconductors.
6.Knowledge of automotive‑electronics quality‑management standards and engineering‑change‑management protocols.
7.Strong professionalism, communication, accountability, execution and pressure‑resistance.
8.Good English proficiency (listening, speaking, reading & writing).

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WB Process Engineer12026-08-06Bachelor’s degree

Requirements: 1.Operate manufacturing equipment proficiently to complete sample fabrication according to specifications.
2.Master QFN / LGA packaging workflows.
3.Lead Continuous‑Improvement‑Project (CIP) initiatives to reduce wire‑bond defects and enhance packaging yield.
4.Skilled in Microsoft Office suite.
5.Evaluate and develop new materials and new manufacturing processes.
6.Good analytical‑problem‑solving skill, communication competence and team‑player mindset.
7.Strong quality‑awareness, sense of responsibility and self‑motivation.

Responsibilities: 1.Bachelor’s degree or above.
2.≥10‑year hands‑on wire‑bond‑process experience; rich copper‑wire‑bonding and room‑temperature‑film‑application experience.
3.Practical operating experience with K&S and ASM wire‑bonding equipment.
4.Proficient with JMP or Minitab statistical software.
5.Deep familiarity with QFN / LGA packaging processes.
6.Capable of independently defining SPEC, SOP, FMEA, CP and OCAP documents; deliver DOE experiments and 8D reports.

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Senior R&D Manager12026-08-06Bachelor’s degree or above, CET‑6

Requirements: 1.Build and develop R&D teams; assign development tasks and supervise project schedules to guarantee on‑time delivery of R&D deliverables.
2.Formulate team‑training plans; promote technical‑skill upgrading to match advanced‑packaging‑technology requirements.
3.Lead R&D for QFN, LGA and power‑semiconductor packaging; optimize manufacturing processes, improve yield and lower production costs.
4.Tackle process bottlenecks and manufacturing technical challenges; define R&D technical roadmaps and sustain technological competitiveness.
5.Lead pre‑research and industrialization of advanced‑packaging and advanced‑power‑packaging technologies to support corporate business transformation toward high‑end domains.
6.Conduct full‑lifecycle R&D‑project governance; balance quality, cost and risk; resolve unforeseen technical incidents.
7.Streamline R&D workflows; oversee patent filings and technical‑document archiving for intellectual‑property protection.
8.Collaborate cross‑functionally with Manufacturing, Marketing and Procurement; deliver technical support and accelerate process‑to‑mass‑production conversion.

Responsibilities: 1.Bachelor’s degree or above in Microelectronics, Semiconductor Science, Materials Science & Engineering or Electronic‑Packaging 2.Technology; Master’s degree preferred. Solid theoretical foundation for semiconductor packaging; expert‑level knowledge of QFN, LGA and power‑semiconductor‑packaging principles; familiar with advanced‑packaging and advanced‑power‑packaging technologies.
≥8‑year semiconductor‑packaging‑R&D experience including ≥3‑year R&D‑team‑management tenure; background at semiconductor‑packaging enterprises focusing on QFN / LGA / power packaging is preferred. Proven track record of R&D, process optimization and mass‑production conversion for QFN, LGA and power‑semiconductor‑packaging products; deep understanding of key process‑control points for die‑attach, wire‑bonding and molding operations.
3.Pre‑research or industrial‑delivery experience for advanced‑packaging technologies (SiC/GaN device packaging, Chiplet integration etc.) or employment at leading‑edge‑semiconductor companies is preferred.
4.Outstanding team‑management and project‑management competencies; capable of resource allocation, schedule control and team motivation; excellent cross‑functional coordination capability.
5.Sharp technical insight and innovative awareness; track cutting‑edge industry technologies and propose innovation‑oriented technical roadmaps responding to AI and new‑energy‑sector packaging‑demands.
6.Strong oral‑ and written‑communication skills; capable of drafting professional R&D documents and effectively interfacing with external partners, clients and research institutions.

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REL & FA Laboratory Supervisor12026-08-06Bachelor’s degree

Requirements: 1.Develop and maintain reliability‑validation plans covering product design, verification, manufacturing and customer‑application phases for company product lines.
2.Understand raw‑material and product manufacturing workflows; cooperate with Design and Quality teams to derive corrective and preventive actions based on product‑failure root‑cause analysis.
3.Oversee laboratory‑environment management as well as safe handling and storage of chemical reagents.
4.Manage periodic maintenance & calibration for lab equipment, test fixtures and physical‑chemistry‑laboratory tools; implement laboratory‑sample‑inventory governance.
5.Sound understanding of semiconductor fundamentals; compile training materials and establish training frameworks; participate in talent recruitment, staff development and career‑path planning to elevate team technical competence.

Responsibilities: 1.Bachelor’s degree or above; CET‑4 or above.
2.≥5‑year working experience in semiconductor industry.
3.Major in Semiconductor, Materials Science, Electronics, Physics or related disciplines.
4.Familiar with ISO/IEC 17025 laboratory‑accreditation requirements, ISO9001, IATF16949 and AEC‑Q100 automotive‑component‑certification standards.
5.Proficient with standard office‑software suites.
6.Strong logical‑analysis, organization and cross‑resource‑coordination capabilities; clear verbal‑expression competency.
7.Self‑disciplined, pressure‑resilient and rigorous working manner.
8.Holding ISO9001 internal‑auditor, metrology‑certificate or CNAS internal‑auditor credentials is preferred.

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DA / WB Equipment Technician52026-08-06College diploma

Requirements: 1.Perform preventive & corrective maintenance and precision calibration for front‑end & back‑end Die‑Attach and Wire‑Bond equipment.
2.Conduct daily equipment re‑configuration and production‑line support & maintenance.

Responsibilities: 1.College diploma or above; ≥1‑year semiconductor‑packaging‑industry experience.
2.Hands‑on familiarity with Die‑Bond equipment: AD838, 8312, TWIN832, BESTEM‑D310, AD832I series; or Wire‑Bond machines manufactured by KNS and ASM.
3.Knowledge of Die‑Attach‑equipment maintenance and machine‑reconfiguration workflows.
4.Basic mechanical‑ & electrical‑engineering knowledge.

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