- About us
Recruiting Procedure:
TitleHeadcountRelease DateEducation
EL&FA Manager12025-11-19Bachelor's degree or above, English proficiency level 4 or above
- Job requirements:
- 1. Responsible for the reliability, openness, and maintenance plans related to the design, validation, production, and customer applications of our company's product line;
2. Familiar with and familiar with the process flow of raw materials and product lines, able to cooperate with design and quality departments, provide improvement measures based on the causes of product failure, and provide preventive measures for such problems;
3. Environmental management of the laboratory, safe use and storage of chemicals;
4. Laboratory related equipment, test boards, physical and chemical laboratory equipment, regular maintenance and management, laboratory sample management;
5. Familiar with the basic principles of semiconductors, produce relevant training materials, develop training outlines and action plans, and be able to select, cultivate, and develop subordinates and talents, continuously improving their professional level and work ability.
- 1. More than 5 years in the semiconductor industry;
2. Majors in semiconductor, materials science, electronics, physics, etc;
3. Familiar with ISO/IEC 17025 testing and calibration laboratory competency criteria, familiar with and master the requirements of ISO9001, familiar with IATF16949 standard, and AECQ100 product certification related standards;
4. Proficient in computer skills and operational abilities;
5. Strong logical analysis ability, organizational communication and coordination ability, clarity and communication, expression ability, able to coordinate internal and external resources;
6. Self discipline, strong resistance to pressure, and rigorous work style;
7. Obtain ISO9001 internal auditor certificate, metrology certificate, CNAS internal auditor certificate, etc.
IE Engineer/Recent Graduate12025-11-19College degree or above
- Job requirements:
- 1. Assist the company in workshop layout design and optimization work;
2. Diagnose and analyze the company's production mode, process flow, and employee efficiency, propose improvement plans, and promote implementation;
3. Promote lean production and improve production efficiency;
4. Responsible for formulating and maintaining standard working hours;
5. Monthly measurement of equipment and manpower, and standard supervision and maintenance.
- 1. Industrial engineering related majors, excellent fresh graduates are also welcome;
2. More than 1 year of IE improvement work experience, proficient in factory logistics design and layout improvement;
3. Proficient in using Excel/PPT office software and possessing CAD drawing skills;
4. Strong logical thinking, comprehensive analysis, communication and coordination skills, and initiative;
5. Identify with traditional Chinese culture, respect parents and teachers, and be willing to engage in public welfare activities.
Cutting Engineer12025-11-19College degree or above, English proficiency level 6 or above
- Job requirements:
- 1. Responsible for semiconductor wafer front-end equipment maintenance, wafer saw related equipment maintenance, upkeep, improvement, and troubleshooting;
2. Responsible for the maintenance, upkeep, and improvement of Wafer SAW equipment;
3. Responsible for equipment automation transformation and handling of equipment downtime anomalies;
4. Responsible for writing, executing, and improving SOP for maintenance of wafer saw, film sticking machine, and cleaning machine equipment;
5. Responsible for program backup of equipment and program optimization after equipment improvement;
6. Responsible for the training and development of station technicians and project managers;
7. Responsible for managing spare parts for equipment, controlling spare parts costs, and tracking their lifespan;
8. Responsible for alarm management OCAP files and writing EFMEA for equipment.
- 1. Majors related to mechatronics and automation control; Proficient in operating PPT and office software;
2. More than 5 years of maintenance experience in semiconductor wafer SAW front-end equipment; And relevant work experience in Wafer SAW process;
3. Familiar with work experience in repairing and maintaining wafer saw equipment such as DISCO, Tokyo Precision, and Jingchuang, as well as designing and optimizing wafer SAW control circuits;
4. Familiar with handling and repairing faults and abnormalities in semiconductor packaging equipment; Experience in handling equipment malfunctions and abnormalities;
5. Foreign language requirement: Able to understand English document materials.
WB Process Engineer12025-11-19Bachelor's degree or above
- Job requirements:
- 1. Proficient in operating equipment and completing sample production according to requirements;
2. Familiar with QFN/LGA packaging process;
3. Able to carry out CIP projects, reduce WB defects, and improve packaging yield,
4. Proficient in using office software such as Office;
5. Possess the ability to evaluate and develop new materials and processes;
6. Possess good communication skills, analytical problem-solving abilities, strong coordination skills, and a sense of teamwork;
7. Strong quality awareness, sense of responsibility, and ambition
- 1. Work experience: More than 10 years of experience in WB technology, with rich experience in copper wire and room temperature film;
2. Proficient in using K&S and ASM equipment
3. Proficient in using JMP or Minitab software;
4. Familiar with QFN/LGA packaging process;
5. Familiar with the development of SPEC/SOP/FMEA/CP/OCAP, able to independently complete DOE and 8D reports
Power Device R&D Engineer12025-11-19Bachelor's degree or above
- Job requirements:
- 1. Responsible for testing MOSFET engineering products, researching power device testing methods, and building software and hardware testing platforms; Execute process development plan according to product research and manufacturing requirements;
a. Including product DC testing, AC testing, and data analysis and organization, to identify product issues and provide timely feedback while ensuring the accuracy of test data.
2. Responsible for product reliability verification, including reliability verification plan, implementation, data collection and organization, failure sample analysis, report writing, etc.
b. Writing and maintaining product wafer level/package level DS files.
3. Responsible for product FA analysis, including engineering product anomaly analysis, reliability anomaly analysis, and competitor product analysis.
4. Responsible for system validation, temperature rise/efficiency/EM testing, data collection, and report writing for MOSFET products.
5. Analysis of customer feedback on technical issues process
6. Responsible for preparing technical specifications for relevant processes Process documents and inspection standards;
7. Responsible for technical process training and providing technical guidance to the production line.
- 1. Have more than 3 years of experience in semiconductor packaging and testing factory testing, familiar with the relevant process flow of semiconductor product packaging and testing;
2. Familiar with testing equipment such as Beijing Huafeng and Lianhe;
3. Understanding the basic principles of semiconductor devices, experience in dynamic and static testing of power devices is preferred;
4. Strong hands-on/analytical ability to quickly solve problems;
5. Familiar with SPC, FMEA and other related professional skills; Capable of data analysis, proficient in using Minitab or JMP for DOE experimental design and analysis.
6. Possess a high sense of responsibility, strong team spirit, and innovation consciousness; Has good stress resistance, learning ability, communication ability, and expression ability.
7. Possess good English listening, speaking, reading, and writing skills.
Project Manager - Small Signal Products12025-11-19Project Manager - Small Signal Products
- Job requirements:
- 1. Develop and implement market research plans, study industry markets, and provide support for the company's development and product strategies;
2. Manage products, including summarizing key information such as product specifications, performance test reports, reliability reports, etc., to form a new product development file. Relevant documents will be organized with the cooperation of the technical data team;
3. Based on customer needs and competitive situation, optimize and improve products, reduce costs and improve efficiency, and launch more competitive products;
4. Urge the business to track the feedback on sample delivery, implement orders, and achieve the goal of mass production transfer for new products;
5. Collection, analysis, and organization of sales data for new products;
6. Promotion and sales of products (including setting sales targets, compiling product information, setting prices, providing product business training, accompanying business to promote products to clients, and tracking and analyzing product promotion effects);
7. Reasonably plan chip and packaging resources;
- 1. Microelectronics, electronics, communication and other related majors;
2. Strong data analysis skills, communication and coordination abilities, and problem-solving skills;
3. Good expression and communication skills in both Chinese and English, proactive, strong sense of responsibility, strong ability to put oneself in others' shoes and departmental awareness;
Sales Manager (Semiconductor)12025-11-19College degree or above, College English Test Band 4
- Job requirements:
- 1. Packaging technology exchange, feasibility assessment of customer packaging requirements;
2. According to the department's annual/quarterly/monthly plan indicators, complete the various sales indicators and payment targets set by the company for the responsible area, provide monthly sales analysis reports and order forecasts, and regularly submit weekly reports Monthly report provision;
3. Develop new customers, regularly visit and maintain customers, mainly engage in technical exchanges with customers.
4. Responsible for collecting, researching, and organizing market information in the packaging industry;
5. Complete other tasks assigned by superiors.
- 1. More than 3 years of experience in QFN/DFN packaging engineering;
2. Proficient in semiconductor QFN/DFN packaging process, with engineering background required and customer resources preferred;
3. Possess market analysis and judgment abilities, good customer service awareness, and excellent interpersonal communication skills;
4. Responsible, able to withstand high work pressure, and adaptable to business trips;
5. Proficient in using office software such as CAD, PPT, EXCEL, etc.
Wafer Strategy Procurement Engineer12025-11-19Bachelor's degree or above
- Job requirements:
- 1. Responsible for the daily work of the chip supply chain, including wafer fab production planning, material preparation planning and other workflows, implementing monitoring and management;
2. Collect market information and develop wafer fab procurement strategies based on company needs, including analyzing and comparing the distribution, technical capabilities, service levels, and prices of mainstream suppliers in the industry; Current situation of competitor suppliers, procurement plans, and price analysis;
3. Maintain cooperative relationships with suppliers, maintain close communication, enable fab to timely understand the company's product and project planning, technical requirements, coordinate supplier resources to promote project implementation;
4. Collaborate with chip development and engineering teams to grasp industry trends and trends;
5. Internally coordinate with technical departments such as process, marketing, and design departments to monitor the progress of new projects and promote the resolution of output and delivery issues involved in mass production projects;
6. Responsible for signing and fulfilling procurement contracts
- 1. Major in microelectronics, electronics, communication or related fields, with more than 3 years of work experience in the chip industry, process integration, product or product design, fab factory, etc., and work experience in supply chain related fields;
2. Have experience in process management and cost control;
3. Strong data analysis skills, communication and coordination abilities, and problem-solving skills;
4. Good expression and communication skills in both Chinese and English, proactive, strong sense of responsibility, strong ability to put oneself in others' shoes and departmental awareness;
Test Engineer (Semiconductor)12025-11-19Bachelor's degree or above
- Job requirements:
- 1. Design and implement a factory quantity product testing plan;
2. Based on the existing testing plan, migrate the testing platform or develop related products;
3. Develop testing programs according to testing specifications Engineering verification Debugging Test program confirmation report. Continuously analyze and optimize the testing program to ensure testing coverage Test stability Consistency and testing time meet expected goals, and improve testing efficiency;
4. Assist in the smooth production of the production line, communicate and interact with other relevant departments, complete the work tasks assigned by superiors, in order to achieve the goal of ensuring product quality and reducing manufacturing costs;
5. Test program version management and batch production management;
6. Organize customer related data.
- 1. Microelectronics, automation and other related majors;
2. Experience in analog circuit and PCB design is preferred;
3. Good programming skills;
4. Responsible for work, proactive in work, strong learning ability, and able to endure hardship;
5. Familiar with various IC testing related platforms.
Equipment Technician12025-11-19College degree or above
- Job requirements:
- 1. Responsible for the daily installation, debugging, maintenance, and inspection of production equipment;
2. Responsible for troubleshooting equipment and handling exceptions;
3. Assist engineers in importing automation equipment;
4. Assist in the installation, debugging, and acceptance of new equipment;
5. Assist engineers in conducting regular maintenance and upkeep of equipment to ensure its normal operation;
6. Responsible for the execution and supervision of automation equipment operation processes;
7. Participate in the design review and improvement of automation solutions;
8. Assist engineers in analyzing and verifying equipment related technical, process, and quality issues;
9. Other tasks arranged by superiors.
- 1. Electronic and Electrical Engineering, Mechanical Automation Major
2. More than 1 year of semiconductor work experience
3. 5s Basic Knowledge
4. Proficient in using various office software
5. Obey organizational arrangements
Accounts Payable Accountant12025-11-19College Degree or Above
- Job requirements:
- 1. Supplier invoice processing:
Receive, review, register, and match invoices (paper or electronic) provided by suppliers.
Core: Strictly conduct "three order matching": verify whether the invoice information is completely consistent with the purchase order, goods/service receipt (warehouse receipt/acceptance form) in terms of quantity, price, project, tax rate, etc.
2. Payment processing and management:
Develop payment plan: Based on the payment terms, payment terms, supplier importance, and company cash flow status between the company and suppliers, arrange payment priorities and timing reasonably.
Prepare payment application/payment form: Ensure that the payment amount, recipient information (bank account number, account name), payment voucher number, etc. are accurate and correct. three
3. Manage payment records: Keep complete payment vouchers and update payment status in the system in a timely manner (such as marking payment dates and voucher numbers).
4. Aging analysis and report:
Regularly prepare accounts payable aging analysis reports, detailing the accounts payable balances for different aging ranges (such as 0-30 days, 31-60 days, 61-90 days,>90 days).
5. Monitor long-term outstanding accounts payable and remind relevant departments to handle them.
Provide management with accounts payable related data and analysis to support cash flow forecasting and decision-making.
6. Accounting treatment related to accounts payable:
Process the application, review, recording, and verification of prepayments (prepaid accounts).
Handle accounting adjustments related to returns, discounts/allowances.
Participate in monthly, quarterly, and annual closing processes to ensure accurate accounts payable accounts.
Assist internal and external audits in providing relevant accounts payable information.
- 1. More than 2-3 years of experience in full process accounts payable accounting (including invoice review, entry, payment, reconciliation, etc.)
2. Proficient in operating financial software (ERP system) such as SAP, Oracle, UFIDA U8/NC, Kingdee K3/EAS, etc. Proficiency in operating the accounts payable module is a core requirement
3. Able to quickly learn new systems, processes, policies, and regulations
4. Able to work closely with other members of the finance team (such as cashiers, general ledger, cost accountants)
FA Engineer12025-11-19College degree or above, undergraduate preferred
- Job requirements:
- 1. Familiar with various equipment and analysis techniques from semiconductor chips to packaging, including SEM, FIB, EMMI, ESD/EOS, and analysis of common FA failure models
2. Cooperate with the process to complete the analysis and report of FA, and provide clarification of issues
3. Evaluation, optimization, and development of new FA equipment and personnel capabilities
- 1. Majors related to electronic circuits, physics/chemistry, etc
2. Familiar with semiconductor production processes and familiar with common failure models in each process
2. English proficiency as a working language